Are you still discussing indium phosphide? Glass substrates, ceramic substrates, ABF substrates, 800G, 1.6T pluggable optical modules, NPO, CPO, PCB solutions, copper powder, spherical silicon micro powder, MLCC, computing power leasing, capacitors, inductors, copper powder, thin-film lithium niobate, crystal oscillators, polarization-maintaining fiber, CW light sources, EML chips, Faraday rotators, DSP chips, optical module coupling equipment, clean rooms, advanced packaging, wafers, copper-clad laminates, resin, electronic fabric, first-generation fabric, second-generation fabric, wire-drawing process weaving machines, and has the 1.6TM­S­AP technology been implemented?

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