Futures
Access hundreds of perpetual contracts
TradFi
Gold
One platform for global traditional assets
Options
Hot
Trade European-style vanilla options
Unified Account
Maximize your capital efficiency
Demo Trading
Introduction to Futures Trading
Learn the basics of futures trading
Futures Events
Join events to earn rewards
Demo Trading
Use virtual funds to practice risk-free trading
Launch
CandyDrop
Collect candies to earn airdrops
Launchpool
Quick staking, earn potential new tokens
HODLer Airdrop
Hold GT and get massive airdrops for free
Pre-IPOs
Unlock full access to global stock IPOs
Alpha Points
Trade on-chain assets and earn airdrops
Futures Points
Earn futures points and claim airdrop rewards
More
SK Hynix is moving early to adopt integrated hybrid bonding equipment
$BESI
The main technical constraint is chemical mechanical planarization. In hybrid bonding, CMP is essential because the surfaces need to be extremely flat and clean. Problems such as copper dishing, erosion, particles, or contamination can directly hurt yield, resistance, and long-term reliability
The AMAT and BESI partnership covers CMP, surface treatment, and hybrid bonding, offering a solution to that problem
The short-term risks are scaling complexity and the fact that JEDEC height rules still remain loose enough for thermocompression bonding to keep working at higher layer counts. That could delay equipment demand