According to South China Morning Post, Biren Technology unveiled new optical supernode systems at the 2026 World Artificial Intelligence Conference, claiming near-packaged optics can connect up to 1,024 AI processor cards in a cluster and help overcome copper-based interconnect limitations.
The Shanghai-based chipmaker, founded in 2019, develops AI and high-performance computing chips including its BR100 and BR104 GPUs. However, its commercial path faces constraints due to TSMC halting production after 2022 U.S. export controls, and multiple Biren entities were added to the U.S. Entity List in October 2023.