Dier Laser Completes Panel-Level Glass Substrate Via-Hole Device Shipment

GateNews
According to Dier Laser's statement on May 25, the company completed shipment of its panel-level glass substrate via-hole (TGV) laser drilling equipment. The TGV laser micro-hole device can be applied to semiconductor chip packaging and display chip packaging, covering both wafer-level and panel-level encapsulation laser technologies.
Disclaimer: The information on this page may come from third-party sources and is for reference only. It does not represent the views or opinions of Gate and does not constitute any financial, investment, or legal advice. Virtual asset trading involves high risk. Please do not rely solely on the information on this page when making decisions. For details, see the Disclaimer.
Comment
0/400
No comments