Dinglongshares Files Hong Kong Listing Application on July 6, Holds 38.5% of China's CMP Polishing Pad Market

According to Hong Kong Exchanges and Clearing on July 6, Dinglongshares (300054.SZ) submitted a main board listing application to the Hong Kong stock exchange, with China Merchants Securities International and CITIC Securities as joint sponsors.

The company is a materials solutions provider for the semiconductor industry, offering chemical mechanical polishing (CMP) solutions, semiconductor display materials, photolithography materials, and advanced packaging materials. According to Frost & Sullivan data for 2025, Dinglongshares holds the largest market share for domestic CMP polishing pads at 38.5% and ranks third in CMP materials with 16.8% market share. The company also leads the OLED coating functional materials segment with 38.5% market share.