SK Hynix Begins Mass Shipment of HBM4 Chips in Q2 2026, Confirms HBM4E Technology Maturity

According to SK Hynix CEO Song Hyun-jong at the company's Q2 2026 earnings call on July 29, mass shipment of HBM4 memory chips began in the second quarter, with production set to expand significantly in the second half of the year. The CEO expressed confidence in HBM4E, the next-generation high-bandwidth memory for AI, stating that it has achieved optimal manufacturing processes with mature technology and stable mass production capabilities. HBM4E samples were supplied to key customers in the first half of 2026.

The company also announced an anticipated annual investment of approximately 40 trillion Korean won and stated it is reviewing multiple approaches for additional shareholder returns, with specific plans to be disclosed once finalized.