SK Hynix Launches 3D Stacked DRAM Research, Recruits Engineers for Edge AI Storage on July 24

SK Hynix-8.33%
SKHY2.54%
SKHYV-0.98%
According to BlockBeats, on July 24, SK Hynix initiated recruitment for 3D stacked DRAM design engineers and plans to collaborate with U.S. customers on technology development. The South Korean chipmaker is actively developing 3D stacked DRAM—a next-generation semiconductor technology that stacks memory chips directly onto logic semiconductors—positioning it as a core solution for edge AI devices in the post-generative AI era. SK Hynix is recruiting engineers through its Americas subsidiary based in San Jose to advance the technology's development.
Disclaimer: The information on this page may come from third-party sources and is for reference only. It does not represent the views or opinions of Gate and does not constitute any financial, investment, or legal advice. Virtual asset trading involves high risk. Please do not rely solely on the information on this page when making decisions. For details, see the Disclaimer.
Comment
0/400
No comments