SK hynix’ tests use Intel EMIB technology; TSMC CoWoS capacity shortage is the main reason

SK hynix, the world’s largest HBM memory supplier, reportedly on the 11th is jointly developing Intel’s 2.5D advanced packaging technology with Intel. Testing involves integrating HBM and logic chips using Intel’s EMIB technology. The move is seen in the industry as an important signal of diversification in AI chip supply chains. With TSMC occupying a long-term monopolistic role, its leading position may face challenges.

TSMC CoWoS is in short supply, and major firms rush to find alternatives

Fueled by the AI wave and a surge in demand for AI accelerators, TSMC’s 2.5D packaging technology, CoWoS (Chip-on-Wafer-on-Substrate), has hit a severe capacity bottleneck.

The core principle of CoWoS is to lay down a full large silicon interposer layer between the chip and the substrate, enabling tight integration between high-performance logic chips like GPUs and HBM. This is currently the key process used by major AI accelerator makers such as NVIDIA and AMD. However, because the interposer area is large and the manufacturing process is complex, TSMC’s CoWoS capacity expansion speed has lagged far behind market demand growth, prompting multiple tech giants to evaluate alternative solutions.

Earlier, including AMD and Apple, reports indicated they are looking for foundry chip manufacturing from Intel or Samsung as they explore establishing backup chip supply sources outside of TSMC.

(AMD reportedly seeks foundry chips from Samsung; TSMC capacity crunch reveals diversification challenges for the supply chain)

Intel’s EMIB technology draws attention; SK hynix actively tests

Against this backdrop, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) technology is gradually coming into view across the industry. Unlike CoWoS’s approach of laying an entire interposer layer, EMIB adopts an “bridge-on-demand” concept—embedding small silicon bridges only at specific locations where chips need to be connected, without covering the entire substrate. This design offers greater flexibility and scalability in chip layout, while also effectively lowering costs.

A Korean media outlet, ZDNet, citing sources familiar with the matter on Monday, reported that SK hynix is currently using Intel-provided EMIB embedded substrates to test the feasibility of integrating HBM with logic chips. It has also begun evaluating the materials and components required for mass production. The sources said that although it is still in the early R&D stage, SK hynix’s attitude is quite proactive.

(Who benefits most from TSMC’s CoWoS overflow? Intel EMIB yields reportedly at 90%; advanced packaging may be the key to a turnaround)

Both sides cooperate for mutual needs; a chance for supply-chain reshuffling emerges

This cooperation has attracted high external attention because the interests of both sides are highly aligned. For SK hynix, even if the company itself does not directly manufacture 2.5D packaging, conducting HBM R&D in advance for the EMIB structure can help optimize product design, and improve yield and reliability—allowing it to seize opportunities in the market.

SK hynix currently has a small-scale 2.5D packaging R&D production line in South Korea, indicating its long-standing effort in this field.

For Intel, this cooperation is a key opportunity to expand its footprint in the advanced packaging business. Intel is currently actively promoting EMIB technology to SK hynix and major OSAT (outsourced semiconductor assembly and test) partners. If it can successfully enter the AI accelerator supply chain, it will inject important momentum into its semiconductor business.

Mid- to long-term outlook: the 2.5D packaging supply chain moves toward diversification

Industry insiders believe that in the mid- to long term, Intel’s EMIB is expected to be formally incorporated into the 2.5D packaging supply chain for AI accelerators, developing in parallel with TSMC’s CoWoS—creating a dual-track structure. This would not only help ease capacity pressure for the AI chip industry that has long relied on a single supplier, but also improve overall supply-chain resilience and bargaining power.

Now, SK hynix and Intel’s cooperation may well be the starting point for the reshaping of the semiconductor supply chain in the AI era.

This article stating that SK hynix tested Intel’s EMIB technology and that TSMC’s insufficient CoWoS capacity is the main reason first appeared on Chain News ABMedia.