South Korea's Lee Calls for Faster Chip, AI Project Rollout as Samsung, SK Hynix Pledge $520B

According to Yonhap, South Korean President Lee Jae Myung on July 6 called for faster rollout of the government's chip cluster and AI projects, including quicker environmental reviews and parallel administrative procedures. Samsung Electronics and SK hynix have pledged a combined 800 trillion won (US$520 billion) for the Honam semiconductor cluster, which is expected to include four fabrication plants. Lee said site selection should move faster, power and water supply work should begin earlier, and a dedicated team should support the cluster development.
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