TSMC Plans to Enable Advanced Packaging Facility in Arizona by 2029

Gate News message, April 22 — Taiwan Semiconductor Manufacturing Company (TSMC) plans to enable an advanced chip packaging facility in Arizona by 2029, according to Chang Hsiao-chiang, senior vice president of TSMC's global business and deputy co-chief operating officer. "We are actively expanding our capabilities within our Arizona facility. We plan to establish CoWoS and 3D-IC capabilities locally by 2029, which remains our target," Chang stated.

CoWoS (Chip-on-Wafer-on-Substrate) is an advanced packaging technology that enables higher integration density, while 3D-IC (three-dimensional integrated circuits) allows for vertical stacking of chips to improve performance and reduce footprint.