TSMC “Sprint to 1nm” vs. Samsung “Consolidate 2nm,” the two leading chip foundries diverge on strategy

With the surge in AI demand, the two global leading semiconductor foundries, TSMC (2330.TW) and Samsung Electronics (005930.KS), are adopting markedly different strategies. TSMC is continuing to accelerate its 1-nanometer process, with plans to gradually mass-produce more advanced nodes starting in 2027; Samsung, meanwhile, is choosing to slow down and concentrate resources on 2-nanometer process optimization and yield improvement. The divergence in their technical roadmaps will affect the future supply landscape for high-performance computing and AI chips.

TSMC roadmap leaks: aims to enter the “angstrom” era in 2029

According to a report by Korean media Zdnet Korea, TSMC has officially revealed the complete development blueprint for its sub-nanometer processes at a recent Q1 earnings call and the North American Technology Forum. Under the plan, TSMC will begin mass production of the A16 process in 2027, formally ushering in a new generation measured in “angstrom (Angstrom).” A16 corresponds to 1.6 nanometers, symbolizing a key milestone as semiconductor process nodes move into the era below 1 nanometer.

After that, TSMC plans to mass-produce A14 in 2028, and in 2029 it will advance both the A13 and A12 nodes in parallel. Among them, A13 is the newest process revealed this month. Compared with A14, it can reduce chip area by 6%, and through (DTCO) technology co-optimization via design and process integration, it further enhances energy efficiency and computing performance.

A12 is built on the A14 architecture and introduces a backside power delivery network technology called “Super Power Rail” (BSPDN), designed specifically for AI and high-performance computing (HPC) needs. BSPDN separates signal processing and power delivery that were originally concentrated on the front side of the wafer, moving the power network to the wafer’s back side. This frees up more space to improve performance and integration density.

(TSMC 2nm “inside-job” case resolved: former engineer gets 10 years, Tokyo Electron fined NT$150 million)

Samsung pivots to defense: 1nm delayed by two years, focusing on solidifying 2nm

Compared with TSMC’s aggressive push, Samsung Electronics has chosen to adjust its pace. Samsung was the first to mass-produce its 3-nanometer process using the ring-all-around (GAA) architecture in 2022, taking the lead in technical breakthroughs. However, at the “SAFE Forum” held last year, Samsung announced that the mass production schedule for its 1.4-nanometer process (SF1.4) would be delayed by about two years, moving from the original 2027 to 2029.

This indicates that Samsung’s current strategic focus has shifted from “racing to be first” to “seeking stability.” Industry insiders say Samsung has not yet proposed a clear process roadmap after 2 nanometers. The company is currently putting all its effort into optimizing 2-nanometer production capacity and improving yields, aiming to win over more internal and external customers and raise capacity utilization rates.

In the latter part of May this year, Samsung is expected to explain its latest strategic direction to the outside world again at the SAFE Forum to be held in the United States, once again with 2-nanometer process as the core theme.

(TSMC and Samsung help each other! Tesla’s AI5 chip completes design approval, target mass production in mid-2027)

AI chip demand heats up; the two powerhouses’ route differences are reshaping the industry landscape

The strategic divergence between TSMC and Samsung in sub-nanometer processes is occurring as AI application demand is exploding across the board, and its impact has already gone far beyond the technical level. With its continued lead in process advancement tempo, TSMC is poised to further consolidate its dominant position in the advanced AI and HPC chip foundry market. Samsung, meanwhile, hopes to gradually build customer trust by relying on stable 2-nanometer mass production capacity, and to be ready for the next technological breakthrough.

In the short term, it’s hard to determine which route is better or worse, because whether it’s the pace of process technology advancement or the stability of mass-production yields, both will become key variables in shaping the competitive map of the foundry market.

This article, “TSMC ‘charging into 1 nanometer’ vs. Samsung ‘strengthening 2 nanometers’: the two foundry giants diverge first,” appeared earliest on Chain News ABMedia.