Samsung and Broadcom Sign $200B+ AI Chip Partnership Through 2030

According to Yonhap Infomax, Samsung Electronics and Broadcom signed a strategic partnership memorandum on July 24 to collaborate on advanced semiconductor infrastructure through 2030 with over $200 billion in planned investment. Under the agreement, Samsung will supply advanced memory products including HBM (high-bandwidth memory) for Broadcom's next-generation AI accelerators, while Broadcom's chipsets will leverage Samsung's sub-2-nanometer foundry processes and advanced packaging technologies.
Disclaimer: The information on this page may come from third-party sources and is for reference only. It does not represent the views or opinions of Gate and does not constitute any financial, investment, or legal advice. Virtual asset trading involves high risk. Please do not rely solely on the information on this page when making decisions. For details, see the Disclaimer.
Comment
0/400
No comments