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TSMC Switches 2.5D Packaging from SiC to Epoxy, Dimming 2025 SiC Demand

GateNews
Stocks
According to Every Economics, Taiwan Semiconductor Manufacturing Company (TSMC) has shifted its 2.5D packaging process to epoxy-based substrates, moving away from silicon carbide (SiC) materials. Industry experts note that this technological pivot undermines the rationale for using SiC as an alternative intermediate layer in advanced packaging. SiC manufacturers faced declining revenues in 2025 amid intensified competition; however, the substrate material remains promising for applications in AI data centers and thermal management solutions.
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