Samsung Electronics signed a strategic partnership memorandum of understanding with Broadcom on the 24th (local time) at the AI Summit in San Francisco. The collaboration, valued at over $200 billion (approximately 280 trillion won), will run through 2030 and focus on building next-generation artificial intelligence core infrastructure. The partnership addresses the growing adoption of custom application-specific integrated circuits by global big tech companies, combining Broadcom's custom semiconductor design strengths with Samsung's memory, foundry, and packaging capabilities to enhance AI semiconductor competitiveness.
The signing ceremony was attended by Han Jin-man, President of Samsung Electronics' Foundry Business, Hock Tan, CEO of Broadcom, executives from both companies, and government officials. President Lee Jae-myung and Samsung Electronics Chairman Lee Jae-yong were also present at the event.
Samsung-Broadcom Partnership Covers Memory, Foundry, and Packaging Through 2030
The two companies will expand cooperation in memory, foundry, and advanced packaging over the next five years. Samsung Electronics will supply advanced memory products including high bandwidth memory to Broadcom's next-generation AI accelerators. The partnership will apply 2-nanometer and below foundry processes and advanced packaging technologies to Broadcom's major products.
Samsung Supplies HBM4 and Applies 2nm Foundry Process to Broadcom Products
Samsung Electronics mass-produced and shipped HBM4 applying 1c DRAM and 4nm base die technology in February. In May, the company supplied HBM4E samples to customers. Samsung's HBM will be utilized to enhance the computational performance and power efficiency of Broadcom's AI accelerators.
In the foundry sector, the partnership will apply 2-nanometer and below processes to Broadcom's major products including next-generation high-speed data communication semiconductors. The companies plan to shorten product development periods by linking semiconductor design, process optimization, packaging, and mass production.
Executives Emphasize Integrated Semiconductor Solutions for AI Era
Jeon Young-hyun, Vice Chairman of Samsung Electronics' DS Division, stated that "in the AI era, semiconductor solutions that tightly integrate memory, logic, and advanced packaging are important." He added, "We will expand cooperation with Broadcom to accelerate the development of future AI infrastructure and provide greater value to customers."
Charlie Kawas, President of Broadcom's Semiconductor Solutions Group, said, "Through cooperation with Samsung Electronics, we will create next-generation solutions optimized for diversifying market demands together."
FAQ
What is the value of the Samsung-Broadcom partnership announced on the 24th?
The strategic partnership between Samsung Electronics and Broadcom is valued at over $200 billion (approximately 280 trillion won) and will run through 2030. The collaboration covers memory, foundry, and advanced packaging for AI infrastructure development.
What specific Samsung products will Broadcom use in its AI accelerators?
Broadcom will use Samsung's high bandwidth memory products including HBM4 and HBM4E in its next-generation AI accelerators. Samsung mass-produced HBM4 in February and supplied HBM4E samples to customers in May. The partnership will also apply Samsung's 2-nanometer and below foundry processes to Broadcom's major products.
