Samsung and Broadcom Sign AI Chip Partnership Worth $200 Billion Through 2030 on July 25

According to Reuters, Samsung Electronics and Broadcom signed a memorandum of understanding on July 25 to expand collaboration on AI infrastructure. The South Korean government estimated the partnership at more than $200 billion over five years through 2030. Under the agreement, Samsung will supply high-bandwidth memory (HBM) for Broadcom's AI accelerators, manufacture Broadcom chips on 2-nanometer and smaller nodes, and handle advanced packaging including 2.5D integration. Samsung separately announced it has shipped commercial HBM4 and is expanding capacity.
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